Fine Pitch Board to Board Connectors: robust board connectivity design for the latest computing technologies


Computing technologies has advanced so fast to correspond with today’s high demand of device for Consumer and Industrial applications. These devices bringing a lot of benefits and convenience to automated, repetitive and critical processes. Within these technologies, the Board connectors has been an important connectivity solution, bridging modules and boards that consists or processors operating in high speed data transmission in order to execute protocols or programs efficiently. The Fine pitch board connectors in particular are the preferred choice of interconnectivity, not only it provides multiple connections in compact size, it is also very reliable in terms of high data transfer in accordance to PCIE and USB standards.

AUK has a broad range of Board connector solutions consisting of 1.0mm of the NPA series down to 0.5mm fine pitches of the NPV series. Along with various features that can support your design requirements such as its stacking height to as low of 3.0mm of the NPVB or other desired stand-off as per needed dimensions available in all the series while connector body widths below 6.0mm and the numerous Pin counts reaching up to 140Pins of the NPET series. In total, the fine pitch board series has unlimited options for you to choose from, whatever is your requirement, it is surely available for your design-in.

 
  • Wide Fine Pitch Options

    Ultra-Narrow pitch distance of 0.5mm of the NPV and NPVB series can support condense Pin count suitable to limited space PCB layout requiring numerous contacts in compact dimensions. While the range extends to 0.65, 0.8 and 1.0mm pitch that can support more functions and higher electrical requirements.
     
  • Stacking Height Flexibility

    Low profile 3.0mm height of the NPV and NPVB series offers compact solutions to Boards and Modules requiring close contact structures. While the selection ranges up to 22.0mm height of the NPE series providing many options to your immediate design-in solutions.
  • High Pin Density

    Wide range of Pins available from 8~140 of the Fine Pitch Board to Board connector series. It can support staggered pin arrangements for adding ground path between differential pairs to effectively reduce crosstalk.
  • Reliable Dual Slot Structures

    Dual Slot offers robust assembly with its dual contact surface suitable in high vibration environment. This provides better transmission protection against discontinuity of signal in many critical applications and demanding processes.
     
  • Low Contact Resistance

    Pins or Contacts are designed with specific copper alloy material ensuring high IACS conductivity values, various plating & finishes for that desired performance and with high spring chracteristics for consistent contact force.
  • GG-SS-GG Layout configuration

    Grounding is an essential part for high speed applications, where Single End or Differential Pairs are utilize in the system. AUK recommends adopting the G-S-G or GG-SS-GG arrangement to ensure grounding paths are available between signal paths for reducing interference.

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